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News
The latest exemptible item summing-up for RoHS Instructions

1 . the mercury content of Compact fluorescent lamps should not exceed
5 mg / lights


2 . mercury content of general purpose of the straight tube fluorescent may
 not exceed:


-- Salt phosphate 10 mg


-- Normal three phosphate 5 mg


-- Long-term effectiveness three phosphate 8 mg


3 . mercury content of special purpose of the straight tube fluorescent


4 . This not specifically mentioned in the appendix of the other lights in mercury content


5 . lead content of Cathode ray tubes, electronic components and Luminous
glass tube


6 . Steel alloy elements in the lead content of 0.35%, aluminum content of 0.4%, copper alloy of lead content of 4%;


7 . -- High-temperature melting of lead solder (ie: Sn-Pb solder alloy of lead
content over 85%);


-- For servers, storage systems and the memory of lead solder (exemption
granted to 2010);


-- For switching, signaling and transmission, and telecommunications network
 management network infrastructure equipment in the lead-free solder;


-- Electronic ceramic products in the lead (for example: high-voltage electronic
devices); (Which in 2005/747 / EC made an amended)


8 . According to modification   about the limitation of specific hazardous
substances and the use of pre-manufactured sales and the 76/769 / EEC
Directive section 91/338 / EEC Directive which are prohibit the cadmium plating
outside. (Which in 2005/747 / EC made an amended)


9 . Hexavalent chromium as carbon steel cooling system preservatives in the
Absorption refrigerators


10 . In accordance with the procedures section in 7 (2), the European
Commission should evaluate the application of the following:


--Deca BDE


-- mercury content of special purpose of the straight tube fluorescent


-- The lead of Following used solder: Servers, storage, exchange and
transmission used in the network infrastructure, telecommunications, network
management equipment (set this directive seeks to exempt part of the specific
cut-off time);


-- Lamp.


11 . The lead used in clockwise connexion system


12 . The lead used in Thermal conductivity of the nail gun module and coat


13 . The lead and cadmium used in optical glass and glass filter


14 . The lead of Microprocessor-pin package and used by the Connexion
containing 80-85% lead compound (containing more than two kinds of
components) of solder


15.The lead used in Flip-chip packaging in the semiconductor chip carrier and
reliable connection between the formation of solder


16 . The lead used in Portland band linear incandescent lamp casing


17 . The lead halide used in Professional copiers in the high-density discharge
lamp as a light


18 . The lead used in Professional uses discharge lamp phosphors as a catalys


19 . The lead used in Small energy-saving [FS:PAGE]lamps in the amalgam with special ingredients


20 . The lead oxide used in LCDs to connect in front of and behind the
fluorescent lamp in glass

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